As XPX's flagship export product in 2025, the MDC-SD-330 revolutionizes industrial die-cutting with:
✔ 330mm/s ultra-fast cutting speed
✔ ±0.1mm micron-level accuracy
✔ Multi-layer processing for cardboard, foam, gaskets & composites
✔ IoT-enabled real-time monitoring via Baidu AI Cloud
Ideal for packaging, electronics, and automotive industries, its servo-driven system reduces energy consumption by 30% while maintaining 24/7 stable operation. The patented Quick-Swap™ blade system minimizes downtime to under 5 minutes.
"The SD-330 increased our production efficiency by 200%," reports a German packaging manufacturer. CE, ISO9001, and UL certified.
Contact XPX for OEM solutions and bulk order discounts.
As XPX's flagship export product in 2025, the MDC-SD-330 revolutionizes industrial die-cutting with:
✔ 330mm/s ultra-fast cutting speed
✔ ±0.1mm micron-level accuracy
✔ Multi-layer processing for cardboard, foam, gaskets & composites
✔ IoT-enabled real-time monitoring via Baidu AI Cloud
Ideal for packaging, electronics, and automotive industries, its servo-driven system reduces energy consumption by 30% while maintaining 24/7 stable operation. The patented Quick-Swap™ blade system minimizes downtime to under 5 minutes.
"The SD-330 increased our production efficiency by 200%," reports a German packaging manufacturer. CE, ISO9001, and UL certified.
Contact XPX for OEM solutions and bulk order discounts.